Visit us at booth 602

SECO presents technologies for embedded systems at Sensors Converge 2024

Discover how SECO’s products, including smart panel PC HMIs, computing boards, boxed solutions, and IoT software, integrate with sensor systems to reduce time-to-market and cost in design engineering applications.
SECO Mediatek IIoT

SECO and MediaTek collaborate to redefine industrial IoT with advanced embedded solutions

Highlighting advanced performance and efficiency with MediaTek semiconductor innovations at embedded world China.
Stefano Baggio

Stefano Baggio appointed managing director of SECO Northern Europe

SECO Northern Europe appointed Stefano Baggio as successor to Luca Buscherini, taking over the role of Managing Director at SECO's Hamburg location.
embedded world China 2024

SECO showcases next-generation technologies at embedded world China 2024

Experience the future of IoT and industrial innovation with SECO’s latest solutions and partnerships at Booth 230
Finanace News Q1 2024

SECO Q1 2024 Results

The Board of Directors of SECO, which met today, has approved the consolidated results for the first three months of 2024.
SECO and Carel partnership

CAREL and SECO working together to develop an innovative solution in the conditioning and refrigeration industry

CAREL Industries S.p.A. (“CAREL”), the world leader in control solutions for conditioning and refrigeration, and SECO S.p.A. (“SECO”), a leading provider of end-to-end technological solutions for industrial digitalization, have signed an agreement to develop a new solution to support the digital transformation of the infrastructures in the segments where CAREL operates.

SECO presents hardware and software solutions for industrial automation at AUTOMATE 2024

Discover how SECO’s products, including smart panel PC HMIs, computing boards, and IIoT software solutions, reduce time-to-market and costs in industrial automation applications.

SECO introduces new COM Express® type 6 module powered by Intel® Atom® processors C7000RE series

Making its debut at embedded world 2024, the SOM-COMe-CT6-ASL elevates industrial-grade edge applications with the Intel® Next Gen Atom® processor.
SECO and Axelera collaboration

SECO to strengthen their collaboration with Axelera AI at embedded world 2024

High performance, low latency AI inference offers significant benefits for OEMs

SECO and NXP collaborate to bring Clea, a comprehensive end-to-end AI solution, to industrial and IoT applications

SECO S.p.A. (“SECO”) is pleased to announce it is working with NXP® Semiconductors (“NXP”), to bring SECO’s Clea software solution to industrial and IoT applications. Clea is the full-fledged AI as a Service (AIaaS) Platform and optimization of Clea on NXP hardware will facilitate the deployment of AI models for device manufacturers across industrial and IoT applications.