SECO, a leading global provider of end-to-end technology solutions for industrial digitalisation, will present a variety of solutions and technologies that enable a new generation of digital devices at the upcoming embedded world Exhibition & Conference in Nuremberg. At stand 1-320, visitors can discover SECO's comprehensive and modular product range. This ranges from high-tech edge computing platforms to the edge and cloud IoT software suite Clea and the AI support system StudioX. All of the solutions presented aim to maximise the potential of their products and fully exploit new technological possibilities.
Computer-on-Modules
At the booth, visitors can discover SECO's latest Computer-on-Module solutions with next-generation processor technologies based on x86 and Arm® architectures. The COM Express® Basic SOM-COMe-BT6-MTL and the COM-HPC® Client SOM-COM-HPC-A-MTL are both equipped with Intel® Core™ Ultra processors (codename: Meteor Lake) and designed for AI and IoT end devices. The SOM-SMARC-MX95 combines the NXP i.MX 95 application processor with a compact, SMARC®-compatible module and offers superior computing power and advanced security features for the next wave of edge applications. The SOM-SMARC-QCS6490 simplifies access to the Qualcomm® QCS6490 SoC and provides support for compute-intensive applications and on-device machine learning. The SOM-SMARC-Genio 700 with the MediaTek Genio 700 application processor is a powerful and energy-efficient solution optimised for demanding industrial IoT applications. SECO has extensive experience in COM design and manufacturing and will introduce its latest addition to the COM Express® portfolio, which is based on next-generation Intel® Atom® processors. This underlines SECO's commitment to remain at the forefront of technological innovation.
Fanless computers
Visitors can also learn about SECO's range of fanless embedded computers designed for seamless system integration in IIoT use cases. Highlights include the Palladio 500 RPL, a fanless embedded PC with 13th generation Intel® Core™ processors (codename: Raptor Lake), which is characterised by its exceptional modularity and expandability. The Modular Link MX93 is a cost-effective industrial PC with NXP i.MX93 application processor is designed for intelligence at the edge, offering simplified integration and unrivalled versatility. The Titan 300 TGL-UP3 AI is an edge AI-enabled solution that combines the processing power of 11th generation Intel® Core™ and Celeron® SoCs with a single Metis AIPU from Axelera AI that can deliver up to 120 TOPS.
Modular Vision HMIs
An integral part of the SECO stand is the scalable Modular Vision HMI family, which offers standard solutions based on x86 and Arm® architectures with screen sizes from 7 to 15 inches and resolutions up to 4K. This versatile platform enables application-specific customisation, allowing users to seamlessly adapt processor performance to changing requirements.
IoT & AI
All SECO hardware products are natively integrated with SECO's modular open-source software suite Clea, which simplifies IoT implementations by utilising field data to generate actionable insights. Clea enables real-time infrastructure management, analytics, predictive maintenance, secure remote software updates and the delivery of intelligent applications and revenue-generating subscription services.
Building on generative AI, SECO will present StudioX, a solution for organisations to increase operational efficiency, improve customer satisfaction and offer new revenue-generating services through their AI-powered support services.
The SECO booth will feature a series of specific application demos with Clea and StudioX in action to illustrate the power and simplicity of data orchestration and AI in various use cases.
Visitors are invited to experience the SECO solutions and meet the experts in person in Hall 1, Stand 320 at the Exhibition Centre Nuremberg from 9 to 11 April 2024.
