Open Standard Modules: The right solution for you?

An Open Standard Module, also called an "OSM," is a standardized and particularly small assembly or circuit board that was developed to facilitate, among other things, the exchange of modules from different manufacturers. The concept is to reduce the variety of manufacturer-specific modules and provide a uniform interface for the use of electronic systems. OSMs are also soldered directly onto the carrier board during assembly.

By providing a unified platform for the modular design of functions, manufacturers of electronic devices can expand the flexibility and expandability of their systems. Open Standard Modules thus fall under the realm of "standardization" and aim for a more flexible and supplier-independent use.

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'As a founding member of SGET (Standardization Group for Embedded Technologies), SECO has always aimed to provide the best possible solution to all customers and stakeholders. Whether it's standard form factors or open-standard modules, we will work together to determine which product is the right fit for your project.'


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The use of Open Standard Modules must always be considered in context. In each specific application, there are advantages and disadvantages that need to be weighed. One significant advantage, for example, is the ability to source these modules independently of the manufacturer. At the same time, the standard is still guaranteed by the Standardization Group for Embedded Technologies (SGET), of which SECO is a founding member. Additional advantages include...

  • ... the possibility of double-sided assembly (Height E).
  • ... a lower price due to the elimination of connector technology.
  • ... the full focus on the actual CPU core.
  • ... a minimal space requirement for core components.
  • ... individual carrier board development.
  • ... less mechanical constraints compared to other standards.

Of course, we also produce standard form factors such as SMARC, QSEVEN or COM Express as well as Trizeps, Myon, or . Because in some cases, an Open Standard Module may not be the appropriate solution:

  • The module cannot be replaced in case of failure.
  • The soldering process for OSM is more demanding: To keep the cost and stress of the carrier board low, the module is usually permanently soldered during the initial soldering process. In some cases, this can lead to the sensitive core being destroyed if there are any errors in the carrier board when it is first powered on.
  • Support capacitors for voltage regulators can only be placed on the top side of the OSM PCB in the standard Height F.
  • As a result, the connections to the power supply points have some induction. Therefore, the processors are operated at a slightly higher operating point (power consumption) compared to modules that can be assembled on both sides.

"Open-Standard-Modules could be the ideal solution for you. However, if you're not entirely sure and would like a non-binding and personal consultation, we are here to support you and work together to implement the best technological solution. We look forward to accompanying you on your project. Please get in touch with us now!"
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SECO has decades of experience in the embedded industry. From modules to single-board computers and human-machine interfaces to artificial intelligence in various industries, countless projects demonstrate our ability to always find a solution. Our focus lies particularly on trend analysis and all kinds of optimizations. As a founding member of SGET, we also emphasize the importance of synergies, research, and development.

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