- Ready-to-use products with minimal "time to market"
- reduced development effort
- highly configurable
- Long-term availability of at least 10 years
- Extensive Form Factor portfolio from 33 x 49 mm to 125 x 95 mm
- Extremely robust connectors for extreme applications
- Integrated Board Support Package (BSP)
- Compatibility with ARM and x86 processors
- Windows Embedded operating systems, Windows 10 IoT Core, Android and Linux can be used
This product family is available in two versions: the "client" version as a classic embedded system and as a natural evolution of the Com Express 6. The "server" version supports networking with broadband Ethernet.
Our extensive range of form factors means you can always make the right choice for your end device. Especially for handheld terminals with small dimensions, the available space must be optimally utilized. Here, our high speed modules with a form factor of less than 40 x 40 mm offer exactly the right solution. These are both powerful and yet power-saving. The same applies to our form factors above 95x95 mm. Our COM Express modules are able to realize powerful IoT applications or to process compute-intensive processes on server class level.
The COM technology realizes the idea of providing recurring core elements on a CPU module in an embedded system and thus reducing the complexity of the hardware design on the customer's side.
The COM (or System on Module (SOM)) bundles the most necessary components such as CPU, RAM and Flash, but also interfaces such as Wi-Fi® and Bluetooth®. A high-density circuit board is used on a relatively small board instead of implementing everything on a large, expensive circuit board. The corresponding COM also comes with the necessary operating system, the Board Support Package - a kind of driver database - and also common software development kits (SDKs). This allows software developers to implement suitable applications relatively quickly.
In addition to our standard modules, we also offer module boards with their own form factor and extensive pin compatibility (e.g. through the SODIMM standard). These modules (Trizeps and Myon) are particularly suitable when customer projects require extremely special specifications or find their use in handheld devices. Thanks to our own form factor, we can implement the requirements on the module in a very short time without having to start a completely new development. The standard is maintained by us up to the latest solutions Trizeps VIII Mini and Trizeps VIII Plus with i.MX 8M Mini and i.MX 8M Plus.
We have made it our business to be able to plan for the long term with our COMs. As far as possible, we only use components that are produced for the long term. All our modules can be purchased for at least 10 years. If, however, a discontinued component has to be replaced, we integrate it in such a way that nothing changes for the customer's hardware and software.
- All critical components are available on the COM CPU modules, thus reducing the hardware design effort on the customer's side.
- The customer's remaining hardware design only includes interface connections in the form of a baseboard.
- The SODIMM contact system of the CPU modules is absolutely "ruggedised" and is used in extreme scenarios.
- Due to their design, our COM CPU modules can be integrated into almost any housing.
- An early start of software development is made possible with a reference design of our evaluation kits or baseboards.
- The Board Support Package (BSP) developed by SECO allows the individual integration of customer-specific drivers. In addition, software development kits (SDK) are available for the development of customer applications.
- As a long-standing Microsoft Gold Partner, we can quickly implement projects with Windows Embedded operating systems (CE 5.0, CE 6.0 R3, Compact 7 and 2013) as well as Windows 10 IoT Core.
- In addition to a Microsoft solution, SECO offers an Android/Linux development set. This set provides a virtual machine with Ubuntu LTS, which contains a specific BSP and with which an OS image for COM CPU modules can be generated straightforwardly.
The world's first ARM-based SOM (System On Module), also named COM, came from our production facility in Wuppertal (formerly Keith & Koep). The Trizeps I was the first to implement the idea of making the recurring core elements available in an embedded system in the form factor of a SODIMM CPU module. With this system, development times could be significantly shortened and a faster "time-to-market" realised.
This idea became established step by step and is now used worldwide, among others in industrial and medical technology areas. Later, this system became the international industry standard. The first CPU module generation had the SODIMM 144 standard, which was subsequently replaced by the SODIMM 200 standard due to the need for more and more interfaces.
The Myon module series launched a new COM generation with a very compact form factor, making them easy to integrate into high-performance IoT and battery-powered handheld devices.