Today’s digital-first businesses and consumers are generating unprecedented volumes of data from devices and systems unimaginable just a decade ago - and this data needs to be captured and leveraged in real-time for a growing array of use cases emerging at the edge. Take, for example, medical imaging data requiring real-time processing and display to aid in patient care and machine vision applications whereby high-resolution smart cameras must transfer data immediately to drive manufacturing robotics. Also consider the vast amounts of data generated by public sector systems located in avionics, on submarines, or at field bases that require real-time analysis for decision-making. For OEMs and their customers, there is a strong need for high-performance edge computing solutions to drive a new class of complex, data-intensive applications. Powered by 11th Gen Intel® Core™ vPro®, Intel® Xeon® W-11000E Series, and Intel®
Celeron® processors, the SECO CHPC-D57-CSA COM-HPC® Client module Size A helps accelerate processing for data-rich applications while supporting security and reliability in the harshest, most remote environments.
"Use cases like AI at the edge, machine vision, and the increasing cooperation between humans and machines are demanding higher performance overall: to power onboard processing, extend interfacing capabilities, and enable high-end graphics, for example. Built on 11th Gen Intel® Core™ vPro®, Intel® Xeon® W-11000E Series, and Intel® Celeron® processors, SECO’s CHPC-D57-CSA provides a ready-to-use solution to fulfil this need." - Davide Catani, chief technology officer for SECO
Across industries and geographies, the amount of data generated by devices continues to increase. Also, IoT devices used for applications like robotics, warehouse automation, medical imaging, and safety/mission control need to perform reliably even in extreme temperatures and under the most unforgiving environmental conditions. The use of graphics and video in applications is fast growing as well, placing even greater performance demands on edge computing solutions. Today’s competitive landscape requires OEMs and their customers to bring products to market faster than ever before. Accordingly, Computer on Modules (COMs) speed the product development cycle by providing an embedded computing platform with the processing element already included in a standard form factor. As a result, OEMs and their customers can quickly customize the system with an application-specific companion board. COMs today must be highly flexible in their design to ensure the interoperability needed for fast integration with new systems, applications, and devices. And because cyber threats are increasing in prevalence and complexity, it is more challenging than ever to secure edge computing systems and data.
Solution: SECO'S CHPC-D57-CSA COMHPC Client Module Size A, powered by 11th Gen Intel Core, Intel Xeon W-11000E Series, and Intel Celeron Processors
Built on the 11th Gen Intel Core vPro, Intel Xeon W-11000E Series, and Intel Celeron processors, SECO’s CHPC-D57-CSA COM-HPC® Client module Size A (95 x 120 mm) is the latest standard for high-end embedded computing, delivering all the performance, security, and interoperability required to deploy modern applications at the edge. Intel® processors enable near-real-time processing of today’s high data rates while ensuring the reliable uptime and rugged durability to power heavy-workload applications, such as:
- Public sector processes
- Industrial control
- Machine vision
- Digital signage
How it works
Engineered to process heavy workloads at the edge, the SECO CHPC-D57-CSA accelerates data processing with up to eight cores and up to 32 graphics execution units. Four4Kp60 display pipes or one 8Kp60 in high-dynamic-range(HDR) industrial-grade SKUs are included to provide high-end graphics processing. Total memory encryption provides a security layer that can help thwart attacks. Designed and verified for optimized signal integrity including high-speed,off-board interfaces, the module ensures interoperability with carrier boards and third-party devices.
Functional Safety standard compliance support
For systems and applications that must comply with functional safety (FuSa) standards, the SECO CHPC-D57-CSA uses the Intel® Functional Safety Essential Design Package(Intel® FSEDP), which provides the technical documentation needed to support and speed up the development and certification of functional safety applications. Documentation also aids in facilitating the device usage in applications requiring compliance with Functional Safety standards, such as IEC 61508.
SECO’s CHPC-D57-CSA includes these features:
- 20x PCIe Gen 4 lanes, directly managed by the processor core
- Up to 24x PCIe Gen 3 lanes
- 2x DDR4-3200 SODIMM slots with ECC (up to 64 GB)
- Up to 2x NBASE-T Ethernet ports with support for time-sensitive networking (TSN)
- 2x USB 4.0/USB 3.2/8x USB 2.0
Intel processors deliver new level of performance and interoperability at the edge
The SECO CHPC-D57-CSA modules feature 11th Gen Intel Core processors, which deliver significant generation-overgeneration performance gains, including up to a 32 percent performance gain in single-thread performance (1) up to a 65 percent performance gain in multithread performance (2) and up to 70 percent faster graphics performance (3). These gains, and especially the boost in multithread performance,significantly accelerate processing for AI, graphics, and other data-intensive applications.
Conclusion: Intel and SECO bring performance to the edge for a world awash with data
IoT deployments are rapidly growing both in size and complexity, and data is proliferating at the edge like never before. Intel and SECO are helping OEMs and their customers unleash the power of data wherever it resides by delivering the security, connectivity, performance, reliability, and flexibility that modern data-intensive applications require to perform optimally anywhere they are deployed.
Built on 11th Gen Intel Core vPro, Intel Xeon W-11000E Series, and Intel Celeron processors, the SECO CHPC-D57-CSA powers AI, graphics, video, robotics, and other data-rich applications with edge performance, security, and durability. Its modular design allows the SECO CHPC-D57-CSA to be customized in a breadth of configurations to support a new generation of applications that are fast advancing. Together, these technologies are enabling near-real-time computing in the most unconventional locales and settings, driving innovation and productivity everywhere, and transforming applications, industries, and experiences as a result.
Explore the feature-rich capabilities of the SECO CHPC-D57-CSA
Discover the value of 11th Gen Intel Core vPro, Intel Xeon W-11000E Series, and Intel Celeron processors
- Up to 32 % single thread performance gains as measured by SPECrate2017_int_base (1-copy)IC19_0u4 (est.).
- Up to 65 % multithread gain as measured by SPECrate2017_int_base (n-copy)IC19_0u4 (est.).
- Up to 70 % graphics performance gains as measured by 3DMark_v2.11 - Win10 v2009 - Fire Strike - graphics score.
Performance results are based on Intel measurements as of May 25, 2021.
- Processor: Intel® Core™ i7-11850HE (TGL-H) PL1=45W TDP, 8C16T turbo up to 4.7 GHz
- Graphics: Intel® Graphics Gen 12 GFX
- Memory: 32 GB DDR4-3200
- Storage: Intel® SSD 545S (512 GB)
- OS: Windows 10 Pro 20H2
- Bios: TGLSFWI1.R00.4151.A01.2104060640 (Release date: 04/06/2021)
- CPUz microcode: 28h
- Processor: Intel® Core™ i7-9850HE (CFL-H) PL1=45W TDP, 4C8T turbo up to 4.4 GHz
- Graphics: Intel® Graphics Gen 9 GFX
- Memory: 32 GB DDR4-2666
- Storage: Intel SSD 545S (512 GB)
- OS: Windows 10 Pro 20H2
- Bios: CNLSFWR1.R00.X216.B01.2006110406 (release date: 06/11/2020)
- CPUz Microcode: D6h
For more complete information about performance and benchmark results, visit https://edc.intel.com/content/www/us/en/products/performance/benchmarks/overview/.
Notices and disclaimers
Intel® Advanced Vector Extensions (Intel® AVX) provides higher throughput to certain processor operations. Due to varying processor power characteristics, utilizing AVX instructions may cause, a) some parts to operate at less than the rated frequency and, b) some parts with Intel® Turbo Boost Technology 2.0 to not achieve any or maximum turbo frequencies. Performance varies depending on hardware, software, and system configuration, and you can learn more at https://www.intel.com/content/www/us/en/architecture-and-technology/turbo-boost/turbo-boost-technology.html.
- Performance varies by use, configuration and other factors.
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