SECO to launch two off-the-shelf computing solutions based on 11th Gen Intel® Core™ processors

SECO, a Gold Member of the Intel® Partner Alliance, continues its collaboration with Intel® in designing and developing edge solutions that leverage the most innovative and high-performance Intel® platforms. Today, SECO introduces to its product portfolio two new standard form factor solutions – a COM Express® Type 6 Compact Module and a 3.5” single board computer – both based on the 11th Gen Intel® Core™ processors (formerly Tiger Lake UP3).

11th Gen Intel® Core™ processors combine high-performance CPU/GPU engines with integrated artificial intelligence (AI) acceleration and deep learning capabilities in a low power processing platform, built on Intel® third-generation 10 nm process technology. Designed for the Internet of Things (IoT), these processors provide a balance of performance and responsiveness, thus supporting low-latency and time-sensitive applications.

To fully exploit the potential of this platform in a compact, modular solution, SECO developed CALYPSO, a COM Express® 3.0 Type 6 Compact Module offering up to four cores of the Intel® 11th generation CoreTM Series processors. Selected SKUs, specifically designed for industrial applications, also feature Intel’s Functional Safety Essential Design package. The integrated Intel® Iris® Xe Graphics – with up to 96 Execution Units – supports various hardware accelerated video decode/encode standards and can drive up to four independent displays via DisplayPort (DP), eDP, HDMI, DVI, or LVDS interfaces.

The COM Express® CALYPSO has two DDR4 SO-DIMM slots supporting up to 64 GB of DDR4-3200 memory. In-band error correcting code (IBECC) for enhances reliability is supported on selected Intel® Core™ industrial SKUs. Connectivity options include: 4x SuperSpeed USB (5Gbps) host ports; 8x USB 2.0; 1x Gigabit Ethernet; 8x PCI-e x1 Gen 3; PEG x4 Gen 4; and HD audio interface. Microsoft® Windows 10, Microsoft® Windows 10 IoT Core, and Linux operating systems are supported. Thanks to its features, the COM Express® CALYPSO is well suited to applications requiring responsiveness and high-performance, including edge computing, digital signage, transportation, and biomedical devices.

SECO also leveraged the same Intel® processor platform to develop a single board computer in the 3.5” form factor: PRISMA. The PRISMA SBC comes with 2x DDR4-3200 SODIMM memory slots supporting up to 64 GB (IBECC available with Intel® Core™ industrial SKUs). Up to four independent displays at up to 4K resolution are available via DP, eDP, or LVDS interfaces. Connectivity options are wide: 2x 2.5 Gigabit Ethernet; M.2 slot for Wi-Fi/Bluetooth; 4x SuperSpeed USB (10 Gbps); 2x USB 2.0; 4x PCIe Gen 3; 8x GPIOs; and HD audio interface. Microsoft® Windows 10 IoT Enterprise LTSC, Linux LTS and Yocto operating systems are supported.

With availability in the industrial temperature range (-40°C to +85°C), the PRISMA SBC mainly addresses industrial automation and control, surveillance, gaming, and edge computing applications.

Both COM Express® CALYPSO and PRISMA SBC are compatible with SECO’s Clea AI/IoT platform, which easily connects edge electronic devices to the cloud and facilitates real time device monitoring, analytics, infrastructure management, predictive maintenance, secure remote software updates, and more.


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Steven Kluge, Director of Marketing

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