SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches FINLAY, a SMARC® Rel. 2.1 compliant Computer on Module (COM) based on Intel Atom processors x7000E Series, Intel Core i3 processors, Intel Processors N Series (Codename: Alder Lake-N). This happens simultaneously with Intel’s release of this latest generation processor platform, to which SECO was granted early design information and processor silicon to accelerate the development of its solution.
Intel Atom processors x7000E Series and Intel Core i3 processors break new ground for x86 processors in the 6W to 15W power range, delivering exceptional AI acceleration at low power consumption. Multifaceted AI support includes Intel® Deep Learning Boost with Vector Neural Network Instructions (VNNI), and Intel® Gaussian & Neural Accelerator (Intel® GNA) which increases throughput for deep learning audio processing and natural language processing. Integrated Intel® UHD Graphics driven by the Intel® Xe architecture, image processing unit 6 EP (IPU6EP), Pipelock synchronization between two displays (Windows only), and integrated graphics control via the Intel® oneAPI Video Processing Library enhance and streamline video and graphics processing. Critical IoT capabilities include hardware-level virtualization, multi-OS support, and real-time computing. As a complete platform, Intel Atom processors x7000E Series and Intel Core i3 processors enable bring intelligence for low-power, space-constrained, multimedia IoT applications.
Being part of Intel Early Access Program, SECO developed, prior to Intel’s product launch, the FINLAY module, bringing the processors’ power-efficiency to a SMARC® standard module that delivers unmatched levels of CPU, graphics, and AI performance to applications that require a small footprint and low power consumption: digital signage and kiosks with onboard AI, vending machines, medical imaging and telecare devices, industrial automation and control systems, and robotics.
With two to eight CPU cores and thermal design power (TDP) options between 6W and 15W, FINLAY supports up to 16GB LPDDR5-4800 soldered memory, also featuring IBECC (In-Band Error Correction Code) for enhanced reliability without an additional memory chip. FINLAY can drive up to 3 simultaneous 4K displays, via 2x DP++ multimode interfaces and either a eDP or LVDS interface. In addition, FINLAY can manage up to two concurrent streams via MIPI CSI-2 interfaces.
Wide in terms of expandability, FINLAY provides 2x 2.5 Gigabit Ethernet ports with Time-Sensitive Networking (TSN) and Time Coordinate Computing (TCC) for real-time and responsive applications (TSN and TCC on selected SKUs). An optional SGMII interface enables a third Gigabit Ethernet port. FINLAY also provides 4x PCIe Gen3 lanes, 2x USB 3.2 Gen2 ports, 6x USB 2.0 host ports, 1x SATA Gen 3.2 port, and audio. Additional interfaces include 2x HS-UARTs, 2x UARTs, SM bus, I2C, SPI, and up to 14 GPIOs.
Supported operating systems include Microsoft Windows 10 IoT Enterprise and Linux Kernel LTS.
Davide Catani, Chief Technology Officer of SECO S.p.A., says, “FINLAY is going to bring to market enhanced performance and flexibility, to boost what our customers can achieve with solutions based on the SMARC® modular standard form-factor. New generations of industrial applications targeting high power efficiency will leverage the improved multimedia capabilities and increased performance that FINLAY can deliver.”
Specifically developed for media processing, FINLAY addresses the need to reduce the power consumption and footprint associated with video- and image-intensive edge applications.
FINLAY and many other astounding technologies will be exhibited at SECO booth at the embedded world exhibition and conference. Come visit us at booth 1-320 in Nuremberg from March 14 to 16