SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions, today launches CALLISTO, a COM Express® Rel. 3.1 Type 6 module based on new 13th Gen Intel Core processors. SECO was granted early access to design information and processor silicon via its participation in the Intel Early Access Program.
Developed for game-changing design, power, graphics, and AI edge applications, the 13th Gen Intel Core family of processors provides major computing and connectivity performance improvements over the previous processor generation. Enhanced intelligence is provided via a number of technologies, including Intel Deep Learning Boost (Intel DL Boost) to accelerate AI inferencing workloads, the Intel Distribution of OpenVINO toolkit for optimized, cross-architecture deep learning inference, and the use of on-processor graphics execution units for parallel AI processing and image classification performance. Processing performance and power consumption are optimized through a performance hybrid architecture - combining multi-threaded Performance-core (P-cores) and single-threaded Efficient-cores (E-cores) with execution assigned by Intel Thread Director on supported operating systems. Flexible video processing supports one 8K display, four concurrent 4K60 displays, or up to 48 simultaneous 1080p streams via PCIe 5.0.
As an Intel Early Access Program partner, SECO developed the CALLISTO module, bringing the latest processing performance to a COM Express® Type 6 standard form-factor. Thanks to its features, CALLISTO targets high-end applications demanding continuous machine control (High Performance Computing (HPC), industrial automation and robotics, intelligent edge computing, and transportation), complex analysis or decision making (medical imaging, safety, and security), or rich visual experiences (digital signage, information kiosks, and human-machine interfaces (HMIs)).
CALLISTO offers the 13th Gen Intel Core processor family with thermal design power (TDP) options between 15W and 45W in industrial and commercial temperature ranges. Memory consists of up to 64 GB of DDR5-4800 memory via two SO-DIMM slots, also featuring IBECC (In-Band Error Correction Code) and Intel Total Memory Encryption (Intel TME) for enhanced platform reliability and security. An optional on-board NVMe solid state drive (SSD) provides high density storage (factory alternative to one PEG x4 Gen4 interface). An optional trusted platform module (TPM) is available. Up to 96 graphics execution units of the integrated Intel Iris Xe graphics support immersive visual experiences via up to four simultaneous 4K displays, driven by 3x DDI interfaces (supporting DVI, DP 1.4, and HDMI 2.1), 1x VGA (factory option), and 1x eDP 1.3 or single/dual-channel LVDS interface (factory alternatives).
Networking capabilities are represented by a 2.5 Gigabit Ethernet interface with Intel i225 GbE controller. CALLISTO provides a wide range of interface options: 2x USB 4.0 (retimer circuit required on the carrier board), 4x USB 3.2, and 8x USB 2.0 host ports; PEG Gen4 x8 interface, up to 2x PEG Gen4 x4 interfaces, up to 8x PCI-e Gen3 x1 lanes; 2x SATA Gen3 channels; and a number of serial interfaces. Supported operating systems include Microsoft Windows 10 and Linux Ubuntu.
“CALLISTO is a further step forward for our high-end COM Express® modules linecard. Intensive video processing and AI-based analytics are widespreading as the backbone of many industrial applications.” says Davide Catani, Chief Technology Officer of SECO S.p.A. “With CALLISTO our customers will quickly deploy such an approach, even in challenging environmental conditions, like those machinery or autonomous equipment are requiring.”
Developed for both embedded and industrial applications, CALLISTO enables end devices AI and IoT capabilities with faster performance and multi-function control without compromising security and responsiveness. To touch CALLISTO first-hand and discover other disruptive innovations visit SECO booth 1-320 at embedded world 2022, in Nuremberg, Germany, from March 14 to 16.
