SECO and fabless semiconductor company MediaTek have announced a collaboration on a joint market approach in Europe. The aim is to enable customers to quickly design-in current SoC technology from MediaTek. The collaboration will not only enable early development of modules with the new MediaTek Genio 700 processors, but also promote a joint customer approach. This agreement enables SECO to develop corresponding products even before the general availability of MediaTek processors, so that customers can leverage the latest technology as early as possible. As part of the cooperation, an entire product family of HMIs with up to 27" 4K displays will be created in the future.
The new MediaTek Genio processors will help bridge the technology gap between a classic low-power Arm® processor and the powerful x86 technology. The Genio series supports 4K displays and comprehensive AI performance with low power consumption, and is ideal for IoT applications that require high resolution, graphics and computing performance at the same time.
MediaTek is known for its fabless SoC (System on a Chip) technology, which powers devices in the mobile communications, computing, Wi-Fi and IoT spaces with both home and enterprise-focused solutions. With its new Genio processor family, the company plans to expand its roadmap of embedded IoT solutions. The latest development in this series is the MediaTek Genio 700, which is based on 6nm technology. This N6 (6nm) IoT chipset is particularly impressive due to its energy efficiency. It has two Arm® Cortex-A78 cores operating at up to 2.2 GHz and six Arm® Cortex-A55 cores at 2.0 GHz as well as a 4.0 TOPs AI accelerator. The processor supports FHD60+4K60 displays and has an ISP for better image rendering.
Dirk Finstel, CEO of SECO Northern Europe GmbH: “Our cooperation with MediaTek will pave the way for industrial and embedded devices with an unprecedented power/performance ratio. Cutting edge technology from MediaTek enables applications that were literally unthinkable before. This product will set new standards for highly integrated, yet outstandingly powerful Edge AI. Together we will create solutions with extraordinary processing power, low power consumption, premium multimedia capabilities and scalability and join forces to target the market.”
“The MediaTek Genio 700 is an advanced multimedia and AI powerhouse for the next wave of powerful industrial and commercial IoT applications,” said Richard Lu, Vice President of IoT Business at MediaTek. “Collaborations like this one with SECO ensure that device makers have access to advanced solutions like the Genio 700 right away so they can bring products to market faster.”
The MediaTek Genio 700 will be available as a variant for the embedded market from the third quarter of 2023. Through the collaboration, SECO was able to develop the new SMARC® module WILK at a very early stage, which can be used directly with the Genio 700. This means that customers in the industrial, digital signage, vending and medical sectors, for example, have direct access to the latest technology and can start development immediately. This module makes excellent use of the advantages of the Genio 700, which combines high performance with low power consumption and implements this on the extremely compact standard form factor SMARC.
The SMARC® Rel. 2.1.1 module offers a wide range of wired and wireless interfaces. These include two Gigabit Ethernet interfaces, one USB 3.1, two USB 2.0, one CAN, four UART, one MIPI-CSI, one I2S interface as well as optional Wi-Fi® & Bluetooth® 5.0. As a memory unit, the module uses an LPDDR4X-3733 with up to 8GB and four 16-bit interfaces. In addition, an eMMC 5.1 memory with up to 64GB (boot device) is planned. It uses Linux Yocto as the operating system.
Based on the SMARC® module WILK, SECO is planning a new modular fanless HMI product line for 4K requirements with up to 27" in the future.
Meet SECO at embedded world 2023 in Nuremberg and learn more about WILK and the planned new 4K HMI product family. Also experience further innovations from one of the world's leading producers of embedded systems between 14 and 16 March 2023 in Hall 1, Stand 320.
