The international embedded community is preparing to gather in Nuremberg, Germany, from March 14 to 16, for the embedded world Exhibition&Conference. SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions will show its high-tech electronics offering of edge platform, human-machine interface (HMI), communications gateway, custom packaged product, and AI-IoT software solutions.
Leveraging decades of leading-edge embedded computing design, SECO boasts an extremely broad and versatile product portfolio. These solutions can be found at the heart of the most sophisticated and diverse products throughout many industries, from traditional use cases to emerging applications.
SECO edge platforms feature leading processing technologies, based on x86, Arm, and FPGA architectures, from world-class silicon vendors. Such products are available as computer-on-module (COM) and single board computer (SBC) embedded processors, machine-mountable display assemblies, and fully packaged devices. All of SECO’s edge solutions support the integration of Clea, the IoT-AI platform that enables customers to collect and display insightful data from their in-field devices. Intelligent analysis via Clea apps maximizes profit and revenue, minimizes downtime, and optimizes business operations.
At booth 1-320, customers can see and compare samples of the varieties of architectures, form-factors, and processing technologies included in the SECO portfolio.
To start, our off-the-shelf HMI series is available with different installation options and display sizes ranging from 5.0” up to 21.5”. The TANARO 7.0 OF PCT IPS and TANARO 7.0 BX PCT – both featuring NXP’s i.MX 8M Mini processor – will display, respectively, rear mount and panel mount installation options. The most visually appealing flush mount installation will be exhibited via the SANTARO 10.1 SG IPS based on NXP’s i.MX 6 processor family. The FLEXY VISION 15.6, available with Intel® Atom® X Series, Intel® Celeron™ J/N Series, or Rockchip RK3399 processors, will highlight the VESA mounting option with x86 or Arm® architectures and 15.6” HMI touch monitor.
SECO’s boxed fanless embedded computers – both Arm® and x86 based – are system integration-ready and designed for applications in industrial IoT (IIot). Scalable and easy customizable, they provide wired and wireless connectivity for maximum flexibility. Featuring a rugged enclosure, the PHOENIX fanless PC offers the computing power of 11th generation Intel® Core™ and Intel® Celeron® processors (formerly Tiger Lake UP3). Driving up to four displays each up to 4K resolution and multiple network interfaces (2x 2.5 Gigabit Ethernet, Wi-Fi, Bluetooth, and cellular) enable high responsiveness and level performance in the automation, biomedical, surveillance, telecommunications, and multimedia fields.
Being a standards committee member and boasting vast expertise in COM design and manufacturing, SECO offers multiple standard form-factor computer of module (also known as system on module or SOM) circuit board, including SMARC, Qseven®, COM-HPC®, and COM Express®. The modular approach speeds up product design and eases future processing upgrades, easily achievable by replacing the COM incorporated onto a custom-designed application-specific carrier board.
Visitors to the SECO booth will have an exclusive hands-on preview on the latest edge computing platforms launched by the company and will be able to explore their features and possible applications with the help of our experts. Based on Intel® Atom® processors x7000E Series, Intel® Core™ i3 processors, Intel® Processors N Series (formerly Alder Lake-N), SECO will present the new FINLAY SMARC COM. It delivers power efficient deep learning inference and UHD media processing within a small footprint for video- and imaging-intensive applications. Additionally, two new SMARC modules with latest Arm(R) based processors will be launched within the upcoming weeks and will be presented at the show.
The newly launched CALLISTO will highlight the latest in SECO’s COM Express® line card, merging quick and cost-effective high performance computing with rich interface, networking, and graphic processing capabilities. Leveraging the 13th Gen Intel® Core™ processors (formerly Raptor Lake-P), CALLISTO enables end devices AI and IoT capabilities with fast performance and multi-function control without compromising security and responsiveness.
Engineered with high-end processors, COM-HPC® modules answer the growing demand for the highest in processing performance and I/O bandwidth, scalability, power density, and modest size. The COM-HPC® module Client module Size A ORION is powered by 12th Gen Intel® Core™ (formerly Alder Lake-P) processors. With exceptional interface connectivity and flexibility provided by the processor, the board can connect with multiple external hardware accelerators and peripherals, thus delivering outstanding graphics and data throughput performance for automation, sensor fusion, and AI at the edge applications.
Being one of the Qseven® standard founders, SECO continues to introduce new Qseven® modules, with both Arm® and x86 processor architectures. For example, the Qseven® ATLAS COM, based on the Intel® Atom® x6000E Series, Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) family of processors features up to 16 GB of soldered LPDDR4-3200 DRAM.
In addition to the standard form factor boards, SECO also offers its own form factors with the Myon and Trizeps series, which focus on meeting special requirements around small IoT and battery-powered handheld devices or particularly long pin compatibility.
SBC platforms complete SECO’s portfolio of off-the-shelf edge solutions. Featuring standard interfaces, including connectivity, video and USB ports, SBCs are ideal for industrial applications requiring low design investment and short time-to-market. The ICARUS pico-ITX SBC comes with an Intel® Atom x6000E Series or Intel® Pentium and Celeron N and J Series processor. This compact size and high-performance multicore SBC is suitable for applications in edge computing, industrial automation, IoT, surveillance, and transportation.
But that is not all. Exclusively for embedded world visitors, SECO will unveil a selection of new edge platforms that will provide even greater options for optimizing processing capability, video performance, intelligence, and power efficiency in customer products in the coming months. A stop by the SECO booth will be a unique opportunity to learn more in advance.
To take a closer look at these and many other solutions, and to learn more about SECO’s full offerings from Edge to AI, visit us at the embedded world Exhibition&Conference, booth 1-320, in Nuremberg, Germany, from March 14th to 16th.
