SECO and Gopalam Embedded Systems announce collaboration to deliver SECO solutions in the ASEAN region

SECO and one-stop provider of hardware and software solutions for the embedded systems market Gopalam Embedded Systems Pte Ltd (GES), announced today their agreement to cooperate in the Asia-Pacific (APAC) region.

SECO thus enters the ecosystem of technology leaders whose embedded solutions, tools and products are brought to the market in Singapore and the neighbouring ASEAN market by GES. This cooperation will facilitate customers’ access to SECO technology while receiving highly targeted support in the selection of the most suitable solution for their project.

Gopalam Embedded Systems offers a wide range of highly integrated software and hardware development tools from leading vendors across the world, working alongside its customers through the entire development life cycle of embedded systems from design, development and debugging to verification and validation. As a reliable and trusted partner for embedded systems design and development, GES helps its customers accelerate time-to-market across various verticals like aerospace & defence, automotive, consumer electronics, education, industrial and telecommunications.

Through this cooperation, SECO now provides Gopalam Embedded Systems access to a comprehensive portfolio of embedded systems, HMIs and boxed PCs. GES will contribute with its vast experience and in-depth subject matter expertise to the design and development needs of embedded systems. Thanks to this combination, customers will be able to focus on their core business while relying on trusted tools and development solutions for their embedded projects.

“We are excited to announce our collaboration with Gopalam Embedded Systems. SECO will grant GES access to our comprehensive portfolio of embedded systems, HMIs, and boxed PCs, while GES will bring their vast experience and subject matter expertise to support embedded system design and development. Together, we will provide customers with trusted tools and solutions for their projects, allowing them to focus on their core business challenges. This partnership is set to drive success across industries.” says Alessandro Hong, CEO of SECO Microelectronics, the Asia-based subsidiary of SECO S.p.A serving the APAC market.

"We are incredibly excited to announce our strategic cooperation with SECO, a renowned global leader with an impressive 40-year track record in developing embedded microcomputers, integrated systems, and IoT solutions. This collaboration further solidifies our position as a one-stop solution provider for end-to-end embedded design and development tools. SECO's wealth of experience and expertise in delivering full-stack embedded platform solutions, encompassing cutting-edge hardware, software, and applications for Edge to AI development and deployment, perfectly complements our existing offerings. Together, we look forward empower our customers with an unparalleled range of innovative tools and solutions." says Gurunatham Gopalam, CEO and Founder of Gopalam Embedded Systems.


Gopalam Embedded Systems Pte Ltd (GES) is an associate company of the ESA Group in India.

GES, together with the other ESA Group of companies, offers a wide range of highly integrated hardware and software embedded solutions ranging from – Development Suites, Middle-ware Solutions, In-Circuit Debuggers/Emulators, Connectivity Solutions and Hardware Subsystems. Through our ecosystem of tools and development solutions from leading vendors across the world, we holistically support the entire development life cycle of embedded systems from design, development and debugging to verification and validation. At GES, we aspire to support customers with our extensive knowledge and vast experience in embedded systems to help them innovate and deliver superior embedded designs. We enable our customers to concentrate on their core business problems while relying on us to quickly recommend and build tailored solutions for their embedded development. We cater to a broad range of needs across various verticals like automotive, aerospace, defence, education, electronics design/manufacturing, energy, industrial automation, instrumentation, medical devices, military, semiconductor and telecom/datacom