Discovering more about SECO product portfolio showcased at Embedded World 2022

From June 21 to 23, 2022, embedded world Exhibition and Conference, the leading international tradeshow for embedded system technologies, is coming back to Nuremberg Exhibition Centre.

SECO, a global leader of innovative Internet of Things (IoT) and Artificial Intelligence (AI) solutions and a proud long-term exhibitor, will welcome visitors at booth 1-310/1-320 to show its extensive portfolio of embedded computing, human-machine interface (HMI), communication gateway, payment system, custom packaged product, and IoT software solutions.

Leveraging multi-decade experience in design and manufacturing, SECO embedded products feature leading edge processing technologies, based on x86, Arm, and FPGA architectures, from world-class silicon vendors. These edge products are available in standard form-factor computer on module (COM), single board computer (SBC), machine-mountable display modules, and fully packaged and certified device formats. Adding intelligence via the Clea IoT/AI software suite easily connects edge electronic devices to the cloud and facilitates real time device monitoring, analytics, infrastructure management, predictive maintenance, secure remote software updates, and more. SECO will demonstrate part of its wide portfolio at embedded world.

SECO’s HMI and boxed solutions are system integration-ready and are meant for applications in industrial IoT, where flexibility and security are critical.

IoT sensor access point Easy Edge, with the ESP32-D0WD-V3 microcontroller, provides mobile connectivity (LTE-M/NB-IoT/2G + Wi-Fi, BT), geolocation features, and low power consumption. Once installed on an industrial or commercial machine and enabled with Clea, on-board Artificial Intelligence algorithm execution transforms the device, such as a coffee machine  or vending machine into a smart one. Just like Easy Edge, all SECO’s edge computing platforms can be AI-enabled with Clea. 

The FLEXY VISION product family offers seven HMI monitors in various sizes (7", 10", 13.3”, 15.6”, and 21.5”) and processor architectures (Arm and x86). Designed to fill specific HMI application needs with excellent graphics, wide connectivity, and flexibility, FLEXY VISION provides off-the-shelf smart displays to applications from digital signage to infotainment, and from vending to industrial automation. In addition to the well-known FLEXI VISION series, the product portfolio has been expanded to include the modular Proven Concept HMI Portfolio by Garz & Fricke with Flush Mount, Rear Mount and Panel Mount installation variants and the Single Board Computers developed for this purpose.

SECO is a standards committee member, designer, and manufacturer of multiple standard form-factor SOMs, including SMARC, Qseven®, COM-HPC®, and COM Express®. By incorporating a SOM computing platform onto a custom-designed carrier board, product developers focus on the unique features of their application while leveraging a fully designed and validated computing engine. Future processing upgrades are easily accomplished by replacing the SOM. SECO assists customers with carrier board design.

Being one of the Qseven® standard’s founders in 2008, SECO boasts vast experience in design and production of Qseven® modules, with both Arm and x86 processor architectures. The Qseven® ATLAS SOM, based on the Intel® Atom™ X6000E Series, Intel® Pentium® and Celeron® N and J Series (formerly Elkhart Lake) family of processors features up to 16 GB of soldered LPDDR4-3200 DRAM. ATLAS mounts to standard Qseven® release 2.1 carrier boards and is ideal for applications that require high levels of reliability and excellent fault tolerance.

Among the many SECO SMARC modules showcased at the exhibition, visitors will also be able to discover more about LEVY, a SMARC® Rel. 2.1.1 module with NXP’s i.MX 8M Plus Applications Processor. With a neural processing unit (NPU) for efficient machine learning, dual image signal processors, and computer vision library support, LEVY enables complex vision, advanced multimedia, and industrial IoT applications with an Arm processor. Therefore LEVY exploits also the low-power design, scalability, and flexibility of the SMARC form factor. This module is perfect for projects ranging from industrial IoT to HMI and smart digital signage, up to smart city and home automation.

In keeping with SECO’s strategy of offering the latest cutting-edge modular embedded solutions, SECO has introduced a family of COM-HPC® modules. COM-HPC® Client module Size A CARINA, powered by 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) processors with Intel® Iris Xe Graphics Core Gen12 GPU, supports up to four independent displays. CARINA provides improved performance and graphics to accelerate AI and deep learning workloads in embedded use cases.

COM-HPC® Client module Size A LAGOON  features an Intel® Iris Xe Graphics Core Gen12 GPU with up to 32 EU and supports up to 4 independent displays. Engineered with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) processors, helps ensure secure, high-performance computing and interoperability for AI, video, and other data-intensive applications at the edge.

The third module in SECO's COM-HPC® product family is ORION, a COM-HPC® Client module Size A with 12th Gen Intel® Core™ (formerly Alder Lake - H series) processors. With exceptional interface connectivity and flexibility provided by the processors, this board connects with multiple external hardware accelerators and peripherals thus delivering outstanding graphics and data throughput performance for automation and AI at the edge.

SECO also boasts a wide range of COM Express® modules, merging quick and cost-effective customization with rich functionality and graphic processing capabilities. COM Express® modules – both Type 6 and Type 7 – are available in two formats: Compact (3.74 x 3.74 in), a good compromise between high performance and reduced size; and Basic (4.92 x 3.74 in), whose added board area allows for additional features or higher powered processors.

The OPHELIA COM Express® 3.0 Type 6 Compact Module is powered by the AMD Ryzen™ Embedded V2000 SoCs. With integrated “Zen2” CPU and Radeon™ GPU cores with up to seven compute units, OPHELIA is targeted for applications like biomedical, digital signage, gaming, info kiosks, and surveillance.

In addition to the standard form factors, SECO also offers its own form factors with the Myon and Trizeps series by Keith & Koep, which focus on special requirements in the area of small IoT and battery-powered handheld devices or particularly long pin compatibility.

SECO’s portfolio of Arm and x86-based single board computers includes solutions in common standard formats such as pico-ITX and 3.5”, which is characterized by its compact size. Featuring a complete computing solution with standard interfaces, including connectivity, video and USB ports, SBCs are ideal for industrial applications requiring low design investment and minimized time-to-market.

SECO will display the JUNO 3.5” SBC, based on the Rockchip PX30 microprocessor. With its vast connectivity options, JUNO is a high performing but cost-effective SBC easily integrable into industrial applications.

With the SBCSOM by Keith & Koep, a very special solution will also be showcased. This is the world's first solution to combine the advantages of the two product worlds of Single Board Computer (SBC) and System on Module (SOM) by adding basic components and interfaces to a processor module.

These and many other innovations await visitors to SECO booth 1-310/1-320 at embedded world 2022, in Nuremberg from June 21 to 23.